Zusammenbau eines Leiterrahmens mit einem Entkupplungsfilter

Assemblage d'un cadre conducteur et un filtre de découplage

Decoupling filter leadframe assembly

Abstract

A decoupling filter leadframe assembly (162) for improving the signal-to-noise ratio and speed of high performance packaging comprises a leadframe (164) having conductive elements (166) for providing power and ground signals to a semiconductor chip (178) and a decoupling capacitor (169) attached to a power conductive element and a ground conductive element of the leadframe for providing electrical decoupling.

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Patent Citations (3)

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    EP-0142938-A1May 29, 1985AT&T Corp.Circuit intégré semi-conducteur comprenant un support à grille de connexion pour puce
    EP-0268260-A1May 25, 1988International Business Machines CorporationBiegsamer Film-Chipträger mit Entkopplungskondensatoren

NO-Patent Citations (0)

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Cited By (6)

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    CN-101517735-BApril 25, 2012英特尔公司Shape memory based mechanical enabling mechanism
    DE-10334384-A1April 28, 2005Infineon Technologies AgChip device e.g. for communication technology such as mobile phone, uses integrated circuit to form power amplifier and matching circuit for input- or output-impedance matching
    DE-10334384-B4March 27, 2014Infineon Technologies AgChipvorrichtung
    EP-0493967-A1July 08, 1992Samsung Electronics Co., Ltd.Direkte Entkupplung einer Mikroschaltung
    KR-101493866-B1February 16, 2015페어차일드코리아반도체 주식회사전력 소자 패키지 및 그 제조 방법
    WO-2008042180-A1April 10, 2008Intel CorporationMécanisme d'activation mécanique basé sur la mémoire de forme