The invention discloses a location ejecting device for a stamping die. The device comprises a jacking mechanism, a carrying plate, location ejection blocks, a lower die holder and a guide rod. The bottom of the jacking mechanism is arranged on the jacking mechanism and can lift or drop down the carrying plate. The location ejection blocks are arranged at the two ends of the top of the carrying plate respectively. The lower die holder is arranged at the lower end of the jacking mechanism and can be detachably connected with the stamping die. The guide rod penetrates the lower die holder to be connected with the carrying plate. By means of the device, two-way location and flanging are achieved through the location ejection blocks arranged at the two ends of the carrying plate, and accordingly, occupied space can be reduced; as two-way location and flanging are achieved, the use number of the location ejecting devices can be reduced, the die mounting debugging time is saved, the probability of damage to the carrying plate can be reduced, and the die service life can be prolonged. Besides, by the detachable connection between the lower die holder and the stamping die, the location ejecting device can be selected according to stamping dies of different sizes, and the location ejecting device can be mounted and maintained conveniently.