用于夹持半导体器件的装置

Apparatus for clamping semiconductor device

Abstract

The invention relates to an apparatus for clamping a semiconductor device. The apparatus comprises: a pedestal, which is used for placing a semiconductor device; a pressing plate, which is arranged above the semiconductor device and is connected with the pedestal by a distance adjusting unit; and an elastomer, which is arranged between the pressing plate and the semiconductor device and is used for realizing press fitting of the semiconductor device. The distance adjusting unit is configured to be able to adjust the distance between the pedestal and the pressing place and enable the compression value of the elastomer to be changed into a set value, so that the elastic force of the elastomer is equal to the press fitting force needed by the semiconductor device. According to the invention, compared with the prior art, the assembling process of the apparatus is simpler, so that the time and effort are saved and the assembling efficiency is improved.
本发明涉及一种用于夹持半导体器件的装置,其包括用于放置半导体器件的底座;设置在半导体器件的上方的压板,压板通过调距单元与底座连接;设在压板与半导体器件之间的用于压装半导体器件的弹性件。其中,该调距单元构造成能够调整底座与压板之间的距离,并使弹性件的压缩量变成设定值,从而使得弹性件的弹力等于半导体器件所需的压装力。根据本发明的用于夹持半导体器件的装置的组装过程比现有技术更加简单,从而可以省时省力,提高组装效率。

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